SwiftComp
SwiftComp is a revolutionary multiscale, multiphysics composite simulation code that quickly and easily delivers the accuracy of 3D FEA at the efficiency of simple engineering models. In doing so, SwiftComp reduces barriers for engineers by enabling them to model composites as easily as metals using conventional structural elements in their FEA codes (without losing accuracy while capturing all the microstructural details). SwiftComp provides unified modeling for 1D (beams), 2D (plates/shells), or 3D structures, calculating all the effective properties. Use SwiftComp either independently for virtual testing of composites or as a plug-in to power your conventional structural tools with high-fidelity composites modeling. SwiftComp can compute the best structural model for use in macroscopic structural analysis, as well as perform dehomogenization to compute the pointwise stresses in the microstructure. SwiftComp directly interfaces with ABAQUS, ANSYS.
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Simcenter Simsolid
Simcenter Simsolid is a Siemens simulation and structural analysis tool that helps designers and engineers analyze fully featured CAD assemblies without geometry simplification or meshing. By removing two of the most time-consuming steps in traditional FEA, it allows teams to validate structural performance much faster. The software can handle large and complex assemblies, including models with rough contact surfaces, gaps, or overlapping geometry. Simcenter Simsolid delivers accurate results in seconds to minutes on a standard PC, making it useful for rapid design comparison and simulation-driven development. It supports a wide range of analysis types, including linear and nonlinear statics, thermal analysis, modal analysis, fatigue analysis, dynamic simulations, buckling, composites, and random response. With CAD interoperability, advanced connections, materials, boundary conditions, and visualization tools, Simcenter Simsolid helps teams bring better products to market faster.
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GENOA 3DP
GENOA 3DP is an Additive Manufacturing design tool and software suite for polymers, metals and ceramics. The simulate to print toolset showcases robust capabilities and seamless user interactivity making it a suitable solution for various applications. Providing users with accuracy down to the micro-scale and reducing material waste & engineering time considerably, GENOA 3DP can quickly be integrated into any process for an optimum AM build. Founded on progressive failure analysis methods, and combined with multi-scale material modeling, GENOA 3DP allows engineers to accurately predict void, net-shape, residual stress, crack growth and other anomalies associated with as-built AM parts. Providing a repeatable methodology to improve part quality, reduce scrap rate, and meet specification, GENOA 3DP bridges the gap between material science and finite element analysis.
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DIGIMU
DIGIMU® generates digital polycrystalline microstructures representative of the material's heterogeneities (compliance with the topological characteristics of the microstructure). The boundary conditions applied to the REV are representative of that experienced by a material point at the macroscopic scale (thermomechanical cycle of the considered point). Based on a Finite Elements formulation, the various physical phenomena involved during metal forming processes are simulated (recrystallization, grain growth, Zener pinning due to second phase particles, etc.). In order to improve digital precision and to reduce computation times, the software is capable of providing a precise description of the interfaces (grain boundaries) while using an appropriate number of elements thanks to a fully automated anisotropic meshing and remeshing adaptation technology.
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